MS&T’08 Technical Program

Copper and Copper Based Alloys in the Electronics Industry
The electronics industry being diverse to many markets, fast paced and under miniaturization; thrives on alloy development, plating development and novel techniques in applications engineering. This symposium is devoted to the necessary innovation in materials and technology for this vibrant industry.

Topics:

• New alloy/coating developments
• Enhanced mechanical, thermal and electrical properties
• Reliability performance (alloy/coating)
• Novel electronic product applications (materials focused)
• New materials testing, assessment techniques and failure analysis

Organizer: Larry Wojnicz, Molex, Inc.; Co-organizers: J. Stainbrook and B. Rickett, Molex, Inc.; P. Robinson, Olin Brass; G. Schuez, Wieland-Werke AG

Electroceramics Technologies: The Past and Future - A Celebration of the 50th Anniversary of the ACerS Electronics Division 
The symposium will celebrate the 50th anniversary of the division and will showcase both the past and the future of electronic ceramics. The inception of the division dates to a time in the history of electroceramics that is of particular importance, highlighted by the discovery of perovskite materials that still form the foundation of key industries today. Historical areas that will be considered include dielectric ceramics for capacitors, multilayer ceramic capacitors, dielectrics for microwave applications, lead-based ferroelectrics for piezoelectric applications, ferroelectric thin films for non-volatile memory applications, ceramic packaging materials, high temperature superconductors, and fuel cell materials. Invited speakers for the symposium will include individuals from both academia and industry who have made contributions of historical significance. Other invited speakers will include individuals who continue to study and expand the field. 

Topics:

• Dielectric materials for capacitor, packaging and microwave applications
• Piezoelectric materials and devices
• Thin film electroceramics
• High temperature superconductors
• Fuel cell materials

Organizer: Robert Schwartz, University of Missouri-Rolla; Co-organizers: Siu-Wai Chan, Columbia University; Sharmila M. Mukhopadhyay, Wright State University

Fabrication, Microstructures and Interfacial Properties of Multifunctional Oxide Thin Films
Multifunctional oxide thin films exhibit fascinating properties and phenomena on many aspects and have become the subject of many experimental and theoretical studies. Synergistic research effort of growth, microstructures, interfaces and physical properties will yield fundamental knowledge in fabricating high quality thin films of a various type of microstructures that possibly have an immense impact on nanotechnology by producing new materials and novel devices. A challenge issue is the sensitive nature of physical properties of oxides to chemical stoichiometry, interface structure, strain, and processing conditions. Point defects, internal boundaries and metal/oxide interfaces play a critical role for catalytic, electronic, optical, and magnetic properties. Interfaces become particularly important issues in miniaturization to nanoscale dimension of memories, sensors, electronic and magnetic devices, etc. A combination of theoretical calculation, characterization and processing is a key to understand structure property relationships of thin films and interfaces. This symposium will provide a forum for discussion of the latest progress in research and development on oxide thin films and their interfaces.

Topics:

• Fabrication issues of oxide thin films
• Characterization of microstructures, defects, interfaces and adhesion/buffer layers
• Ferroelastic, dielectric, ferroelectric, magnetic, and optical properties 
• Theoretical modeling of growth mechanisms, interfacial structures and microstructures
• Self-assembled nanopillars and the scale influence on the properties
• Composition and property graded nanostructures
• Effect of substrate surface on microstructures, interfaces, and properties
• Nucleation and evolution of ferroelectric domains and electric switching 
• Role of interfaces and microstructures in resistance switching devices

Organizer: Xiaoqing Pan, University of Michigan; Co-organizers: Quanxi Jia, Los Alamos National Lab; Jiechao Jiang, University of Texas at Arlington; R. Ramesh, University of California at Berkeley; Isao Tanaka, University of Kyoto; C. Chen, University of Texas at San Antonio

Ferroelectrics and Multiferroics
The purpose of this symposium is to provide an international forum on state-of-the-art of ferroelectrics and multiferroic materials. The symposium will cover thin films, single crystals, normal/relaxor ferroelectrics, piezoelectric ceramics, magnetoelectric composites, multiferroic ceramic and crystals, microscopic characterization, modeling and simulation of ferroelectric behavior. Special sessions on multiferroics and nanoferroic phenomena will be conducted emphasizing the importance of this research in present times. Recent work on synthesis, characterization, and theoretical modeling of ferroic and multiferroic nanomaterials and thin films are among the topics that will be discussed. Novel approaches to nanostructuring, characterization of material properties and physical responses at the nanoscale will also be emphasized. The symposia will consist of regular, invited and keynote presentations.

Topics:

• Piezoelectric materials
• Single crystals/relaxors
• Domain switching and phase transition behavior
• Epitaxial and oriented films, materials integration, strain-induced phenomena
• Multiferroics and magnetoelectric composites
• Synthesis and characterization of nanoferroic materials
• Physical properties and nanoscale phenomena in ferroelectric, ferromagnetic, and magnetoelectric thin films and nanostructures
• Interface structures and epitaxial behavior
• Nanoscale piezomechanical phenomena
• Theory and modeling in atomic processing dynamics and mechanisms

Organizer: Shashank Priya, Virginia Polytechnic Institute and State University; Co-organizers: P. Clem, Sandia National Laboratories; D. Viehland, Virginia Tech; A. Khachaturyan, Rutgers University; X. Tan, Iowa State University; C. Chen, University of Texas at San Antonio

Interfaces and Defects in Functional Oxides
Functional oxides are of significant and wide-reaching scientific and technological interest. Their properties are greatly influenced by nano and sub-nanostructures. Electron microscopy is an essential tool for investigating these aspects. For example, line and point defects, interfaces and other extended defects influence a rich spectrum of physical properties, such as ferromagnetism, ferroelectricity, large dielectric response, superconductivity, multifunctionality and sensing behavior. With new advances in instrumentation and methods, such as aberration-correction, in situ measurements and holography, fundamental structure-property relationships are being elucidated. For example, it has become possible to directly image oxygen columns in ceramic materials. This symposium explores new insights on structure-property relationships of functional oxides enabled by novel instrumentation and methods in electron microscopy.

Topics:

• Characterization of extended defects (e.g., interfaces, grain boundaries) and line defects and their influence on properties
• Interfaces between oxide and non-oxide, such as between oxides and metals, oxides and semiconductors as well as oxides and organic materials
• Characterization of epitaxial oxides for electronic applications
• Nanocharacterization of amorphous oxides and relationship to properties
• Growth/nucleation mechanisms and defect evolution of oxides determined by in situ measurements including different diffraction techniques
• Novel transmission electron microscopy techniques applied to functional/electronic oxides
• Electron microscopy studies related to the applications of oxides in electronic devices and catalysis

Organizer: Siu-Wai Chan, Columbia University; Co-organizers: Susanne Stemmer, University of California, Santa Barbara; Judith C. Yang, University of Pittsburgh

International Symposium on Advanced Dielectric Materials and Electronic Devices
The symposium covers the recent developments of material design, material preparation, properties, manufacturing issues, cost containment applicable to dielectric materials, electronic devices.

Topics:

• Design, preparation and applications
• Composition, processing, microstructure, and property relationships
• Advancement in dielectric and piezoelectric materials: synthesis, applications and characterization
• Synthesis and properties of thin films, thick films and multilayer materials and devices
• Ferroelectric relaxors and piezoelectric single crystals
• Amorphous and semiconducting dielectrics
• Metal-ceramic composites and nano composites for microelectronic packaging applications
• Dielectric green tapes for electronic devices
• Manufacturing issues to improve product yields and reliability
• Mechanism, modeling and designing issues for dielectric systems 

Organizer: K.M. Nair, E.I. DuPont de Nemours & Company Inc.; Co-organizers: D. Suvorvov, Jozef Stefan Institute; R. Guo and A.S. Bhalla, The Pennsylvania State University; S.M. Mukhopadhyay, Wright State University; R.W. Schwartz, University of Missouri-Rolla; S.I. Hirano, Nagoya University

Low Temperature Processing for Integration of Microelectronics Devices
Recently, multifunctional devices with multiple integrated material classes have been developed to enable compact electronic products. Technologies to incorporate materials with different characteristics like piezoelectric, magnetic and ferroelectric films in one device are desired for microelectronic industrial fabrication. However, because many kinds of materials (metal, ceramics and resin) have different optimum process temperatures, it is difficult to incorporate different materials. To overcome the above technical issues, low temperature processing is regarded as one key technology. This symposium focuses on various low temperature processing methods and their application for microelectronics devices including personal electronics, consumer electronics, and sensor systems. It will encompass various novel and innovative spray coating methods such as aerosol deposition and the novel 2D and 3D integration schemes enabled by these low temperature processing methods and LTCC, and ceramic-polymer composites.

Topics:

• Aerosol deposition cold spray coating and gas deposition ink-jet printing LTCC (Low Temperature Co-fired Ceramics)
• Anodic coating and hydrothermal method
• Ceramic/polymer composite for electronics integrated electronics ceramic component with multifunction embedded passive technology

Organizers:
P.G. Clem, Sandia National Laboratories; J. Akedo, National Institute of Advanced Industrial Science and Technology; Y. Imanaka, Fujitsu Laboratories Ltd.

Pb-Free, Pb-Bearing Joining and Packaging Materials and Processes for Microelectronics
This symposium will provide the attendees with an opportunity to present and discuss the material and process related themes in the areas of joining and packaging in microelectronics. Tentatively planned topics include, but are not limited to: (1 the design and characterization, both microstructural and mechanical, of soldering and other joining materials; (2 materials service reliability related issues, such as thermomechanical fatigue, electromigration, whisker growth, etc., focusing on measurement, prevention methodology, and techniques of materials and joint degradation in service; (3 materials and processes developed for more advanced packages, such as thermoelectrics, optoelectronics, and MEMS, etc. Presentations will continue to encourage new technologies and techniques in soldering processes, metallization (board and component finishes), and alternative interconnects for stress and thermal management at both the wafer level, and chip to package level.

Topics:

• Microstructural characterization
• Mechanical properties of solders and solder joints
• Service reliability of materials and packages
• Materials and processes for advanced packages

Organizer: Fu Guo, Beijing University of Technology; Co-organizers: K. Subramanian and T. Bieler, Michigan State University

Perovskite Oxides: Films, Nanostructures, Properties, and Applications
The endeavor of this symposium is to promote an extensive discussion of the latest progress in R&D of perovskite oxides, concentrated on materials, processes, chemistry and interfaces, basic physics, and application of perovskite oxide films and nanostructures. This symposium will bring together scientists and engineers to present the most up-to-date advances on the synthesis, characterization, and theoretical predication of dielectric, piezoelectric, ferroelectric, ferromagnetic, multiferroic, superconducting, and other perovskite oxide films and their nanostructures. As such, different approaches for films and nanostructures, structure-property relationships, chemistry and interfaces, process integration issues, and applications of these materials will be among the topics highlighted. Novel approaches to composite films, nanostructures, characterization of materials, physical responses at the nanoscale will also be emphasized.

Topics:

• Growth of perovskite oxide films and nanostructures
• Physical properties of perovskite oxides
• Nanocomposite perovskite oxides
• Multilayered and heterostructured perovskite oxides
• Processing related issues for perovskite oxide films
• Applications of perovskite oxide films

Organizer: Q.X. Jia, Los Alamos National Laboratory; Co-organizers: M. Paranthaman, Oak Ridge National Laboratory; S. Chan, Columbia University; H. Wang, Texas A&M University; W. Wong-Ng, National Institute of Standards and Technology